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NEWS
PECVD furnace can process semiconductor materials. PECVD (Plasma Enhanced Chemical Vapor Deposition) system is a thin film deposition equipment based on plasma chemical vapor deposition technology, which can deposit thin films on various materials, including semiconductor materials.
Commonly used rotating tilted PECVD electric furnace (click on the image to view product details)
PECVD technology has multiple important applications in the semiconductor industry. For example, PECVD is one of the important technologies in the manufacturing process of integrated circuits. By precisely controlling process parameters, PECVD can deposit high-quality thin films on substrate surfaces, such as dielectrics like silicon dioxide and silicon nitride. These films play an important role in isolating multiple conductive layers and capacitors in integrated circuits.
In addition, PECVD technology also has the advantages of high deposition speed, good deposition quality, and high material controllability, which can meet the requirements of complex material deposition. Although PECVD technology also has some problems, such as material non-uniformity, low yield, and high equipment cost, these problems can be overcome by adjusting the process parameters of the PECVD system, optimizing the equipment structure, and improving the gas feeding device. It has been widely applied in fields such as microelectronics, optoelectronics, flat panel displays, and energy storage.
Various types of PECVD electric furnaces with different configurations (click on the image to view more PECVD electric furnaces)
So, PECVD furnaces can not only process semiconductor materials, but also play an important role in the semiconductor industry.Click to learn more PECVD devices! Or click on online customer service to learn more about product information!
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